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Wafer level encapsulation - a transfer molding approach to system in package generation

 
: Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Oystermann, U.; Manessis, D.; Aschenbrenner, R.; Reichl, H.

:

Lee, C. ; Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section; IEEE Components, Packaging, and Manufacturing Technology Society; International Microelectronics and Packaging Society -IMAPS-:
4th Electronics Packaging Technology Conference, EPTC 2002. Proceedings : 10 - 12 December 2002, Grand Copthorne Waterfront Hotel, Singapore
Piscataway, NJ: IEEE Service Center, 2002
ISBN: 0-7803-7435-5
ISBN: 0-7803-7687-0
pp.235-244
Electronics Packaging Technology Conference (EPTC) <4, 2002, Singapore>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-36156.html