2003
Conference Paper
Title

Wafer level encapsulation for system in package generation

Author(s)
Braun, T.
Becker, K.-F.
Koch, M.
Bader, V.
Manessis, D.
Neumann, A.
Ostmann, A.
Aschenbrenner, R.
Reichl, H.
Mainwork
Conference
DOI
Language
English