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Wafer level encapsulation for system in package generation

 
: Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Manessis, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.

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Pietriková, A.:
Integrated management of electronic materials production : 26th International Spring Seminar on Electronics Technology, ISSE 2003 ; conference proceedings ; May 08 - 11, 2003, High Tatras, Slovak Republic
Piscataway, NJ: IEEE Service Center, 2003
ISBN: 0-7803-8002-9
pp.505-511
International Spring Seminar on Electronics Technology (ISSE) <26, 2003, Stara Lesna>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-36149.html