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Stencil printing technology for 100 mum flip chip bumping

 
: Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
International Symposium on Microelectronics 2003. Proceedings : November 18 - 20, 2003, Hynes Convention Center, Boston, MA
Washington, DC: IMAPS, 2003 (SPIE Proceedings Series 5288)
ISBN: 0-930815-71-8
ISBN: 0-8194-5189-4
pp.241-246
International Symposium on Microelectronics <36, 2003, Boston/Mass.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-36147.html