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Design process supporting simulations on wafer level packages

 
: Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.

:

Bergman, K. ; IEEE Components, Packaging, and Manufacturing Technology Society:
DTIP of MEMS & MOEMS: Design, test, integration and packaging of MEMS/MOEMS 2003 : Fifth Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS ; Mandelieu-la-Napoule, Côte d'Azur, France, 5 - 7 May 2003
Piscataway, NJ: IEEE Service Center, 2003
ISBN: 0-7803-7066-X
pp.45-49
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <5, 2003, Mandelieu-la-Napoule>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-36146.html