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Transition to lead free soldering - a great chance for a better understanding of materials and processes and green electronics

: Müller, J.; Griese, H.; Schischke, K.; Stobbe, L.


IEEE Reliability Society:
International Conference on Asian Green Electronics: Design for Manufacturability and Reliability, AGEC 2005. Proceeding : March 15 - 18, 2005, Shanghai New International Expo Centre SNIEC, Shanghai, China
Piscataway, NJ: IEEE Operations Center, 2005
ISBN: 0-7803-8806-2
ISBN: 0-7803-8807-0
International Conference on Asian Green Electronics (AGEC) <2005, Shanghai>
Conference Paper
Fraunhofer IZM ()
green electronics; lead free interconnection technology

The lead ban in electronics - enforced by environmental concerns and legal reality by 2006 through RoHS directive has initiated a broad rethinking towards eco/sup 2/-efficiency (economical and ecological) of interconnection technology its materials and processes. The implementation of lead free soldering however is not a drop-in process. In order to secure the production of high quality and reliable lead free products with low environmental burdens by 2006 there are still various technological issues to be solved. This paper gives an overview of environmental (e.g. toxicity and energy demand) and technological issues (e.g. higher thermal stress, whisker formation) deriving from the implementation of lead free soldering processes. It is shown which technological innovations have been initiated through a better understanding of interconnection materials and processes. Substitution of lead in the interconnection system is just the first step to green electronics. The next step is the wise selection of an alternative system and technology based on a profound understanding of the ecological and economical facts.