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Mechanisms of low-temperature wafer bonding

 
: Reiche, M.; Radu, I.; Gabriel, M.; Zoberbier, M.; Hansen, S.; Eichler, M.

Hobart, K.D. ; Electrochemical Society -ECS-, Electronics Division:
Semiconductor wafer bonding VIII. Science, technology, and applications : Proceedings of the international symposium; Eighth International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications, held in May 2005 in Quebec City, Canada, as part of the 2005 spring meeting of the Electrochemical Society
Pennington: Electrochemical Society, 2005 (Electrochemical Society. Proceedings 2005-2)
ISBN: 1-566-77460-8
pp.326-337
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications <8, 2005, Quebec>
Electrochemical Society (Spring Meeting) <2005, Quebec>
English
Conference Paper
Fraunhofer IST ()

: http://publica.fraunhofer.de/documents/N-35558.html