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Solderjet bumping technique used to manufacture a compact and robust green solid-state laser

 
: Ribes, P.; Burkhardt, Thomas; Hornaff, Marcel; Kousar, S.; Burkhardt, D.; Beckert, Erik; Gilaberte, M.; Guilhot, D.; Montes, D.; Galan, M.; Ferrando, S.; Laudisio, M.; Belenguer, T.; Ibarmia, S.; Gallego, P.; Rodriguez, J.A.; Eberhardt, Ramona; Tünnermann, Andreas

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Fédéli, J.-M. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Integrated Photonics: Materials, Devices, and Applications III : 4-6 May 2015, Barcelona, Spain
Bellingham, WA: SPIE, 2015 (Proceedings of SPIE 9520)
ISBN: 978-1-62841-643-5
Paper 952009, 7 pp.
Conference "Integrated Photonics - Materials, Devices, and Applications" <3, 2015, Barcelona>
English
Conference Paper
Fraunhofer IOF ()

Abstract
Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals due to a localized and minimized input of thermal energy. The Solderjet Bumping technique is used to assemble a miniaturized laser resonator in order to obtain higher robustness, wider thermal conductivity performance, higher vacuum and radiation compatibility, and better heat and long term stability compared with identical glued devices. The resulting assembled compact and robust green diode-pumped solid-state laser is part of the future Raman Laser Spectrometer designed for the Exomars European Space Agency (ESA) space mission 2018.

: http://publica.fraunhofer.de/documents/N-354561.html