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Numerical characterisation of electronic packaging solutions based on hidden dies
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2005
Conference Paper
Titel
Numerical characterisation of electronic packaging solutions based on hidden dies
Author(s)
Sommer, J.-P.
Michel, B.
Ostmann, A.
Hauptwerk
ICEPT 2005, 6th International Conference on Electronics Packaging Technology 2005
Konferenz
International Conference on Electronics Packaging Technology (ICEPT) 2005
DOI
10.1109/ICEPT.2005.1564694
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM