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Numerical characterisation of electronic packaging solutions based on hidden dies

 
: Sommer, J.-P.; Michel, B.; Ostmann, A.

:

Wang, C. ; Institute of Electrical and Electronics Engineers -IEEE-:
ICEPT 2005, 6th International Conference on Electronics Packaging Technology 2005 : La Waterfront Hotel, Dameisha, Shenzhen, China, August 30 to September 2, 2005
Shenzhen, 2005
ISBN: 0-7803-9449-6
pp.300-306
International Conference on Electronics Packaging Technology (ICEPT) <6, 2005, Shenzhen>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-35365.html