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Photonic interconnects for data centers

 
: Tekin, T.; Hakansson, A.; Pleros, N.; Apostolopoulos, D.

International Microelectronics and Packaging Society -IMAPS-:
47th International Symposium on Microelectronics, IMAPS 2014. Future of Packaging : San Diego, 13.-16.10.2014
San Diego/Calif., 2014
ISBN: 978-0-9909-0280-5
ISBN: 978-0-9909028-0-5
ISBN: 978-1-63439-992-0 (Ausgabe 2015 bei Curran)
pp.862-865
International Symposium on Microelectronics <47, 2014, San Diego/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Power consumption, cost and performance appear as the main metrics in next-generation Data Center. PhoxTroT has been conceived to address optical interconnects at a holistic way among all hierarchy levels: chip-to-chip, board-to-board, rack-to-rack.

: http://publica.fraunhofer.de/documents/N-351529.html