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Accelerated reliability testing and modeling of subsystems based on sintered silver thermal interface materials

: Heilmann, J.; Nikitin, I.; Pressel, K.; Wunderle, B.


Institute of Electrical and Electronics Engineers -IEEE-:
20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014 : September 24 - 26, 2014, Greenwich, London
Piscataway, NJ: IEEE, 2014
ISBN: 978-1-4799-5415-5 (online)
ISBN: 978-1-4799-5416-2 (print)
6 pp.
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <20, 2014, London>
Conference Paper
Fraunhofer ENAS ()

This paper proposes a guideline for the mechanical acceleration of end-of-lifetime prognostics of metal based die attach materials. As a such, we used first an advanced nano-effect sintered silver layer as interface between die and substrate which has very god electrical and thermal conductivities. Two pairs of experiment/simulation are scheduled. An isothermal mechanical 3-pt bending experiment to induce fatigue the specimens rapidly as well as a thermal induced strain fatigue by thermal chamber for validation. The manufactured specimens are designed to be used for both. With a FEM of this subsystem to simulate the failure parameter which is the accumulated von Mises strain, lifetime modelling is possible.