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Efficient nondestructive 3D defect localization by lock-in thermography utilizing multi-harmonics analysis

: Naumann, F.; Altmann, F.; Grosse, C.; Herold, R.

Electronic Device Failure Analysis Society -EDFAS-, Materials Park/Ohio; American Society for Metals -ASM-, Metals Park/Ohio:
40th International Symposium for Testing and Failure Analysis 2014. Conference Proceedings : November 9 - 13, 2014, George R. Brown Convention Center, Houston, Texas, USA
Materials Park, Ohio: ASM International, 2014
ISBN: 1-62708-074-0
ISBN: 978-1-62708-074-3
ISBN: 978-1-62708-075-0
International Symposium for Testing and Failure Analysis (ISTFA) <40, 2014, Houston/Tex.>
Conference Paper
Fraunhofer IWM ()

Lock-in Thermography in combination with spectral phase shift analysis provides a capability for non-destructive 3D localization of resistive defects in packaged and multi stacked die devices. In this paper a novel post processing approach will be presented allowing a significant reduction of measurement time by factor >5 in comparison to the standard measurement routine. The feasibility of the approach is demonstrated on a specific test specimen made from ideal homogenous and opaque material and furthermore on a packaged hall sensor device. Within the case studies the results of multiple single LIT measurements were compared with the new multi harmonics data analysis approach.