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Enhanced tool cutting edge detection for ultra precision diamond machining applying a conventional setting system

: Reiser, W.; Brecher, C.; Wenzel, C.; Ellinghaus, J.M.

Leach, R. ; European Society for Precision Engineering and Nanotechnology -EUSPEN-:
14th International Conference & Exhibition of the European Society of Precision Engineering and Nanotechnology 2014 : 2nd June-6th June 2014, Dubrovnik, Croatia; EUSPEN 2014
Bedford: Euspen, 2014
ISBN: 978-0-9566790-3-1
pp.327-330 (Vol.1)
European Society for Precision Engineering and Nanotechnology (EUSPEN International Conference) <14, 2014, Dubrovnik>
Conference Paper
Fraunhofer IPT ()

Tool setting precision is a basic requirement in ultra-precision diamond machining since it directly affects achievable machining accuracy. Different tool setting methods have evolved and brought to commercial availability. Probably the most accurate ones are based on LVDT, some apply machining of test parts and probably most wide spread are camera based systems. Systems touching the diamond tool cutting edge generally bear the risk of damaging especially fragile tools with high clearance angle. Camera based systems offer limited accuracy because of the characteristics of the optical systems applied and the need of removing the systems during machining. Applying sub-pixel interpolation methods and calibration after repositioning inside the machine system before every single measurement are two possibilities to cope with limited accuracy. [1] Thus, all of the systems in use imply specific drawbacks. Therefore, the feasibility of a non-contact tool setting system from conventional machining for ultra-precision machining is tested. This includes integration into the machine control, repeatability tests and development of adapted measuring cycles. Modifications of the system to further improve fitting ultra-precision requirements are yet to come. A major focus applying the system was to realize automated tool setting procedure to limit machine operator influence as much as possible.