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Power modules with embedded chips for automotive applications

 
: Ostmann, A.; Boettcher, L.; Hofmann, T.; Neeb, C.; Kuschke, R.; Manessis, D.; Lang, K.-D.

MESAGO PCIM GmbH, Stuttgart:
PCIM Europe 2013. Proceedings. CD-ROM : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013
Berlin: VDE-Verlag, 2013
ISBN: 978-3-8007-3505-1
pp.414-420
PCIM Europe <2013, Nuremberg>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The automotive industry has a strong demand for highly reliable and cost-efficient electronics. Especially the upcoming generations of hybrid cars and fully electrical vehicles need compact and efficient 400 V power modules. Within the engine compartment installation space is of major concern. Therefore small size and high integration level of the modules are needed. Conventionally IGBTs and diodes are soldered to DCB (Direct Copper Bond) ceramics substrates and their top contacts are connected by heavy Al wire bonds. These ceramic modules are vacuum soldered to water-cooled base plates. Embedding of power switches, and controller into compact modules using PCB (Printed Circuit Board) technologies offers the potential to further improve the thermal management by double-sided cooling and to reduce the thickness of the module. In order to replace DCB ceramics a structure of thermal laminate material between thick Cu layers has been developed and the capability for thermal conduction and electrical insulation has been evaluated. For the assembly of large power IGBTs of more than 100 mm2 size new silver sintering pastes have been evaluated. They enable a low pressure sintering at 200 °C, compatible to PCB materials. To handle the high switching current up to 200 A, suitable copper tracks in the PCB are required. The realization of such thick copper lines up to 1 mm thickness requires advanced processing, compared to conventional multilayer PCB production. In order to form complex power systems out of modules with embedded chips interconnections by Ag sintering are under development.

: http://publica.fraunhofer.de/documents/N-350730.html