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Electromagnetic interactions between interconnected patch-ring (IPR) structures and planes in electronic packages and PCBs

 
: Ndip, I.; Bierwirth, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.

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Fulltext ()

Electromagnetics Academy, Cambridge/Mass.:
PIERS 2013 Stockholm. Progress in Electromagnetics Research Symposium. Proceedings. Online resource : August 12-15, 2013, Stockholm, Sweden
Cambridge/Mass.: Electromagnetics Academy, 2013
http://piers.org/piersproceedings/piers2013StockholmProc.php
ISBN: 978-1-934142-26-4
pp.1137-1142
Progress in Electromagnetics Research Symposium (PIERS) <2013, Stockholm>
English
Conference Paper, Electronic Publication
Fraunhofer IZM ()

Abstract
In this contribution, an interconnected patch ring (IPR) structure for noise suppression in the cavity of power-ground plane pairs is designed, fabricated and measured. The impact of electromagnetic interactions between an integrated/embedded IPR and power/ground planes in electronic packages and printed circuit boards is extensively studied. Our results reveal that the presence of a metal layer (i.e., a power/ground plane) above an IPR causes the excitation of parallel-plate modes and undesired coupling, which leads to the disappearance of the stopband of the IPR. Design methods to prevent this disappearance are investigated.

: http://publica.fraunhofer.de/documents/N-350615.html