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Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly

: Oliver, M.; Kim, J.-U.; Wang, Z.; Okada, J.; Iagodkine, E.; Choubey, A.; Anzures, E.; Fleming, D.; Dhoble, A.; Truong, C.; Gallagher, M.; Zoschke, K.; Wegner, M.; Töpper, M.

International Microelectronics and Packaging Society -IMAPS-:
9th International Conference and Exhibition on Device Packaging, DPC 2013 : Scottsdale/Fountain Hills, Arizona, USA, 11-14 March 2013
Red Hook, NY: Curran, 2013
ISBN: 978-1-62748-774-0
International Conference and Exhibition on Device Packaging <9, 2013, Scottsdale/Ariz.>
Conference Paper
Fraunhofer IZM ()