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High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures

 
: Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.

Gessner, T.:
Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM : Como, Italy, 23 - 24 March 2010
Berlin: VDE-Verlag, 2010
ISBN: 978-3-8007-3208-1
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <4, 2010, Como>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-350065.html