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Thermo-mechanical ball bonding simulation with elasto-plastic parameters obtained from nanoindentation and atomic force measurements

Thermomechanische Simulation des Drahtbondens mit elasto-plastischen Parametern, die über Messungen per Nanoindentation und Rasterkraftmikroskopie ermittelt wurden
: Wright, Alan; Koffel, Stephane; Kraft, Silke; Pichler, Peter; Cambieri, Juri; Minixhofer, Rainer; Wachmann, Ewald

Postprint urn:nbn:de:0011-n-3499523 (1.1 MByte PDF)
MD5 Fingerprint: c7558fdf573fb202546052eec51208cc
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Created on: 4.8.2015

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 : 19-22 April 2015, Budapest, Hungary
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-9949-1 (Print)
ISBN: 978-1-4799-9950-7
ISBN: 978-1-4799-9951-4
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <16, 2015, Budapest>
European Commission EC
FP7; 285739; ESTRELIA
Conference Paper, Electronic Publication
Fraunhofer IISB ()
bonding; simulation; plastic deformation; nanoindentation

A ball bonding process was simulated over a high-voltage isolation structure. The removal of an inter-dielectric metal crack-stop layer was investigated through 3D simulation. Material properties for the bonded gold ball were obtained using nanoindentation and atomic force microscopy with a methodology from the work of Ma et al. This yielded both elastic and plastic material parameters. The methodology was then evaluated by using the parameters in a nanoindentation simulation. Although the topography simulated only roughly agreed with measurement, the simulated and measured indenter curves closely overlapped. The parameters were then used in the bonding simulation. The deformation of the bond ball was also measured so that the equivalent deformation could be simulated. This was achieved following the incorporation of both ultrasonic motion and softening in the simulation. Two bonding process geometries were then set up: one with the crack-stop layer present and the other without. Both were simulated and the output was applied within a failure theory to evaluate the risk to the isolation oxide.