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Adhesive-based self-alignment mechanisms for modular stacked microsystems

 
: Braun, T.; Jagodzinska, Jagoda; Becker, Karl-Friedrich; Bauer, Jörg; Georgi, Leopold; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter

Gessner, T.:
Smart Systems Integration 2014 : Wien/Österreich, 26.3.2014 - 27.3.2014; 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components
Aachen: Apprimus-Verlag, 2014
ISBN: 978-3-86359-201-1
8 pp.
Smart Systems Integration Conference (SSI) <2014, Vienna>
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <8, 2014, Vienna>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The development of modularly designed systems could provide a cost-effective alternative to state-of-the-art manufactured microsystems. The purpose of this research was to develop a robust, cost-effective and low-temperature module assembly for the production of modular stacked systems with high positioning precision. To achieve this aim, a new alternative self-alignment process using the surface tension of a resin as a driving force was examined. This was then followed by characterization, simulation and optimization for self-assembly. The experimental results show that viscosity is the main parameter for the self-alignment capability of an adhesive. Furthermore, successful resin self-alignment requires both solid edge and edge treatment. Better results were achieved by dispensing the adhesive by the cross pattern then by the square pattern. In the two-dimensional simulation, it was shown that the self-alignment has a laminar aperiodic motion and the largest aligning forces occur at the beginning of the process.

: http://publica.fraunhofer.de/documents/N-349731.html