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2005
Conference Paper
Titel
Application of 3D-stacking technology for sensor integration and miniaturization
Abstract
Abstract Advanced 3D-stacking-technology on FR4-basis has now reached a degree of matur-ity where it can be used for many electronics applications. This technology is used whenever a higher miniaturization of components or systems and a reduction of costs are required. Efficient solutions can be achieved with standard assembly technolo-gies, such as SMT (surface mount technology), COB (chip on board) or FCOB (flip chip on board). One important operational area of application for 3D-stacking-technology is the field of sensor development and wireless sensor networking. This contribution is concerned with the electrical design, the technologies and the realization of 3D-stacking-technology within this field.