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Reliability potential of epoxy based encapsulants for automotive applications

 
: Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.

:

Labat, N.:
Reliability of electron devices, failure physics and analysis : The 16th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2005, will be held in Archachon ... from October 10th to 14th, 2005
Orlando, Fla.: Elsevier, 2005 (Microelectronics reliability 45.2005,9/11. Special issue)
pp.1672-1675
European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) <16, 2005, Archachon>
English
Conference Paper, Journal Article
Fraunhofer IZM ()

Abstract
Automotive under-the-hood electronics often have to withstand temperatures up to 175 °C in combination with harsh environment conditions. This paper gives an overview about the reliability potential of epoxy based encapsulants for automotive applications. Therefore the resistance of epoxy molding compound against typical automotive fluids at temperature of use is analyzed. Six epoxy molding compounds available on the market, showing high temperature automotive potential have been carefully selected to undergo a media resistance testing. For this purpose a dedicated mold tool has been designed and manufactured to prepare these encapsulants for material testing. Thermo-mechanical, mechanical and thermal properties had been determined in initial state directly after molding and after storage in aggressive fluids typical for automotive applications as e.g. gas oil, automatic transmission fluid (ATF), brake fluid or accumulator acid at the respective temperature of use.

: http://publica.fraunhofer.de/documents/N-34923.html