Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Development of a multi-terminal crimp package for smart textile integration

 
: Simon, E.; Kallmeyer, C.; Schneider-Ramelow, M.; Lang, K.-D.

:

Beyne, Eric (General Chair) ; IEEE Components, Packaging, and Manufacturing Technology Society; Institute of Electrical and Electronics Engineers -IEEE-:
4th Electronic System-Integration Technology Conference, ESTC 2012 : Amsterdam, Netherlands, 17 - 20 September 2012
New York, NY: IEEE, 2012
ISBN: 978-1-4673-4645-0
6 pp.
Electronics System Integration Technology Conference (ESTC) <4, 2012, Amsterdam>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Goal of this work is the development of a new package to be integrated into large-area smart textiles. The benefits of the well-known crimp technology are transferred to a new field. The so-called Crimp Flat Pack (CFP) is a lead-frame based electronic package that features crimp terminals instead of standard leads. The module can be directly attached to different types of substrates, in particular to fabric circuits. Its size and complexity can reach from a simple two-terminal package to larger multi-terminal devices. The standard sized module has a circuit board area of 2 cm × 2 cm and 10 crimp terminals. Eight of them are used for the communication between other modules and for mechanical attachment. Two terminals are used to attach a sensor that collects data inside the fabric. Mainly two tools were developed for the process. At first, a forming tool that bends the contact pins upwards and brings the crimp barrels into shape as well as the actual crimping tool that allows parallel crimping. On the system's side of view the module carries a simple micro-controller and passives. Communication between neighboring modules is done via I2;C-protocol. Measurement of sensor date inside the fabric can be realized. The new package opens opportunities to the manufacturing of smart textiles as it uses standard manufacturing technologies as well as a robust, low-cost, and low-temperature interconnection technology.

: http://publica.fraunhofer.de/documents/N-345178.html