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Electro-optical backplane demonstrator with integrated multimode gradient-index thin glass waveguide panel

 
: Schröder, H.; Brusberg, L.; Pitwon, R.; Whalley, S.; Wang, K.; Miller, A.; Herbst, C.; Weber, D.; Lang, K.-D.

:

Schröder, H. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Optical Interconnects XV : 9-11 February 2015, San Francisco, California
Bellingham, WA: SPIE, 2015 (Proceedings of SPIE 9368)
ISBN: 978-1-62841-458-5
Paper 93680U
Conference "Optical Interconnects" <15, 2015, San Francisco/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Optical interconnects for data transmission at board level offer increased energy efficiency, system density, and bandwidth scalability compared to purely copper driven systems. We present recent results on manufacturing of electrooptical printed circuit board (PCB) with integrated planar glass waveguides. The graded index multi-mode waveguides are patterned inside commercially available thin-glass panels by performing a specific ion-exchange process. The glass waveguide panel is embedded within the layer stack-up of a PCB using proven industrial processes. This paper describes the design, manufacture, assembly and characterization of the first electro-optical backplane demonstrator based on integrated planar glass waveguides. The electro-optical backplane in question is created by laminating the glass waveguide panel into a conventional multi-layer electronic printed circuit board stack-up. High precision ferrule mounts are automatically assembled, which will enable MT compliant connectors to be plugged accurately to the embedded waveguide interfaces on the glass panel edges. The demonstration platform comprises a standardized sub-rack chassis and five pluggable test cards each housing optical engines and pluggable optical connectors. The test cards support a variety of different data interfaces and can support data rates of up to 32 Gb/s per channel.

: http://publica.fraunhofer.de/documents/N-343642.html