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Strategies for precision adhesive bonding of micro-optical systems

: Müller, T.; Venu, V.K.; Haag, S.; Zontar, D.; Sauer, S.; Wenzel, C.; Brecher, C.


Glebov, A.L. (Ed.) ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Components and Packaging for Laser Systems : 9-12 February 2015, San Francisco, California
Bellingham, WA: SPIE, 2015 (Proceedings of SPIE 9346)
ISBN: 978-1-62841-436-3
Paper 93460E
Conference "Components and Packaging for Laser Systems" <2015, San Francisco/Calif.>
Conference Paper
Fraunhofer IPT ()

Today's piezo-based micromanipulator technology allows for highly precise manipulation of optical components. A crucial question for the quality of optical assemblies is the misalignment after curing. The challenge of statistical deviations in the curing process requires a sophisticated knowledge on the relevant process parameters. An approach to meet these requirements is the empirical analysis such as characterization of shrinkage. Gaining sophisticated knowledge about the statistical process of adhesive bonding advances the quality of related production steps like beam-shaping optics, mounting of turning mirrors for fiber coupling or building resonators evaluating power, mode characteristics and beam shape. Maximizing the precision of these single assembly steps fosters the scope of improving the overall efficiency of the entire laser system. At Fraunhofer IPT research activities on the identification of relevant parameters for improved adhesive bonding precision have been undertaken and are ongoing. The influence of the volumetric repeatability of different automatic and manual dispensing methods play an important role. Also, the evaluation of UV-light sources and the relating illumination properties have a significant influence on the bonding result. Furthermore, common UV-curing adhesives are being examined on their performance and reliability for both highest precision prototyping, as well as their application as robust bonding medium in automated optics assembly cells. This paper sums up the parameters of most influence. Overall goal of these activities is the development of a prediction model for optimized shrinkage compensation and thus improved assembly quality.