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DTIP 2015, 17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

27 - 30 April 2015, Montpellier, France
 
: Benoit, Charlot; Mita, Yoshio; Nouet, Pascal; Pressecq, Francis; Schröpfer, Gerold; Rencz, Marta; Schneider, Peter
: Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society

Piscataway, NJ: IEEE, 2015, XIV, 392 pp.
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS <17, 2015, Montpellier>
ISBN: 978-1-4799-8627-9
ISBN: 978-1-4799-8545-6
ISBN: 978-1-4799-8625-5
English
Conference Proceedings
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()
modeling; smart systems; manufacturing; MEMS; RF devices; simulation; integrated process

: http://publica.fraunhofer.de/documents/N-341222.html