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2014
Conference Paper
Titel
Interposer based wide IO processor integration
Abstract
Further improvements in system performance are often limited by the achievable bandwidth between processor and memory. In this paper we look at interposer-based and stacked solutions to integrate processor and memory into a high performance system. The comparison reveals the current advantages of interposer-solutions. This is underlined by thermal and technological considerations. Even though physical design tradeoffs are existent, we show an actual implementation of the chosen technology.
Author(s)