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Manufacturing 100-µm-thick silicon solar cells with efficiencies greater than 20% in a pilot production line

 
: Terheiden, B.; Ballmann, T.; Horbelt, R.; Schiele, Y.; Seren, S.; Ebser, J.; Hahn, G.; Mertens, V.; Koentopp, M.B.; Scherff, M.; Müller, J.W.; Holman, Z.C.; Descoeudres, A.; Wolf, S. de; Nicolas, S.M. de; Geissbuehler, J.; Ballif, C.; Weber, B.; Saint-Cast, P.; Rauer, M.; Schmiga, C.; Glunz, S.W.; Morrison, D.J.; Devenport, S.; Antonelli, D.; Busto, C.; Grasso, F.; Ferrazza, F.; Tonelli, E.; Oswald, W.

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Physica status solidi. A 212 (2015), No.1, pp.13-24
ISSN: 0031-8965
ISSN: 1862-6300
ISSN: 1521-396X
ISSN: 1862-6319
European Commission EC
FP7-ENERGY; 256695; 20PLµS
English
Journal Article
Fraunhofer ISE ()
Solarzellen - Entwicklung und Charakterisierung; Silicium-Photovoltaik; feedstock; Kristallisation und Wafering; Oberflächen - Konditionierung; Passivierung; Lichteinfang; Kontaktierung und Strukturierung; Pilotherstellung von industrienahen Solarzellen; silicon; cell; wafer; efficiency; Production Line

Abstract
Reducing wafer thickness while increasing power conversion efficiency is the most effective way to reduce cost per Watt of a silicon photovoltaic module. Within the European project 20 percent efficiency on less than 100-mu m-thick, industrially feasible crystalline silicon solar cells ("20pl mu s"), we study the whole process chain for thin wafers, from wafering to module integration and life-cycle analysis. We investigate three different solar cell fabrication routes, categorized according to the temperature of the junction formation process and the wafer doping type: p-type silicon high temperature, n-type silicon high temperature and n-type silicon low temperature. For each route, an efficiency of 19.5% or greater is achieved on wafers less than 100 mu m thick, with a maximum efficiency of 21.1% on an 80-mu m-thick wafer. The n-type high temperature route is then transferred to a pilot production line, and a median solar cell efficiency of 20.0% is demonstrated on 100-mu m-thick wafers.

: http://publica.fraunhofer.de/documents/N-332084.html