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Electrode-Substrate-Package Co-Design for Implantable Biomedical Microdevices
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2000
Conference Paper
Titel
Electrode-Substrate-Package Co-Design for Implantable Biomedical Microdevices
Author(s)
Stieglitz, T.
Schüttler, M.
Beutel, H.
Meyer, J.-U.
Hauptwerk
MICRO.tec 2000. VDE World Microtechnologies Congress: Applications - Trends - Visions. Proceedings. Vol.1
Konferenz
World Microtechnologies Congress (MICROTEC) 2000
Language
English
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Fraunhofer-Institut für Biomedizinische Technik IBMT