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Ultrathin soldered flip chip interconnections on flexible substrates
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2004
Conference Paper
Titel
Ultrathin soldered flip chip interconnections on flexible substrates
Author(s)
Pahl, B.
Loeher, T.
Kallmayer, C.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
54th Electronic Components & Technology Conference 2004. Proceedings. Vol.2
Konferenz
Electronic Components and Technology Conference (ECTC) 2004
DOI
10.1109/ECTC.2004.1320273
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM