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Ultrathin soldered flip chip interconnections on flexible substrates

 
: Pahl, B.; Loeher, T.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.

:

IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Industries Alliance -EIA-; Electronic Components, Assemblies, and Materials Association:
54th Electronic Components & Technology Conference 2004. Proceedings. Vol.2 : Las Vegas, Nevada, USA, June 1 - 4, 2004
Piscataway, NJ: IEEE Service Center, 2004
ISBN: 0-7803-8365-6
ISBN: 0-7803-8366-4
pp.1244-1250
Electronic Components and Technology Conference (ECTC) <54, 2004, Las Vegas/Nev.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-33003.html