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Bond reliability of new quality Au and Cu wires at high temperature load > 175 ºC
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2004
Book Article
Titel
Bond reliability of new quality Au and Cu wires at high temperature load > 175 ºC
Author(s)
Schneider-Ramelow, M.
Lang, K.-D.
Ferber, A.
Meier, P.
Hauptwerk
Materials mechanics for system integration and packaging
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM