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Life cycle thinking for green electronics

Basics in EcoDesign and the UNEP/SETAC life cycle initiative
 
: Mueller, J.; Griese, H.; Schischke, K.; Stobbe, I.; Norris, G.A.

:

IEEE Components, Packaging, and Manufacturing Technology Society:
International IEEE Conference on the Asian Green Electronics, AGEC 2004. Proceedings : January 5 - 6, City University of Hong Kong, China, January 7 - 9, 2004, Mission Hills Resort, Shenzhen, China
Piscataway, NJ: IEEE, 2004
ISBN: 0-7803-8203-X
pp.193-199
International Conference on Asian Green Electronics (AGEC) <2004, Hong Kong>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Transferring life cycle thinking into business practice requires applicable assessment tools and management approaches. Different methods from screening eco design tools to full Life Cycle Assessment have been developed for fostering environmentally compatible electronics design. Life Cycle Assessment still deals with many obstacles, limiting its integration into electronics design workflows. The paper describes the state of the art for eco design in electronics and potential improvements for life cycle thinking to be achieved by the global Life Cycle Initiative of UNEP. … The specific needs of the electronics sector regarding life cycle thinking and LCA will be discussed. As a case study for screening assessments an evaluation of a multifunctional chip card is presented, referring to end-of-life scenarios.

: http://publica.fraunhofer.de/documents/N-32990.html