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Modern wire bonding technologies - ready for the challenges of future microelectronic packaging

 
: Lang, K.-D.; Harman, G.G.; Schneider-Ramelow, M.

Michel, B.; Aschenbrenner, R.:
The world of electronic packaging and system integration : Anniversary edition 60th birthday of Herbert Reichl
Dresden: ddp Goldenbogen, 2004
ISBN: 3-932434-76-5
ISBN: 978-3-932434-76-1
pp.332-339
English
Book Article
Fraunhofer IZM ()

Abstract
Increasing I/O numbers and device complexity, higher clock frequencies, and the trend to product miniaturization in microelectronics as well as microsystems strongly require a quantum jump from current Wire Bonding technology. High quality manufacturing (speed and reliability) of wire bonds, especially in the range of pitches below 50 µm, depends on advanced materials, high precision bonding tools, and sophisticated equipment. Together with modern product engineering, optimized technology development and extreme quality parameters, high process yield/stability can and must be achieved. This paper covers new developments and trends of materials and bonding equipment as well as bond quality and reliability.

: http://publica.fraunhofer.de/documents/N-32913.html