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Novel MEMS CSP to bridge the gap between development and manufacturing
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2004
Conference Paper
Titel
Novel MEMS CSP to bridge the gap between development and manufacturing
Author(s)
Jung, E.
Wiemer, M.
Aschenbrenner, R.
Färber, A.
Hauptwerk
54th Electronic Components & Technology Conference 2004. Proceedings. Vol.1
Konferenz
Electronic Components and Technology Conference (ECTC) 2004
DOI
10.1109/ECTC.2004.1319436
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM