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High precision passive alignment flip chip assembly using self alignment and micromechanical stops
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2004
Conference Paper
Titel
High precision passive alignment flip chip assembly using self alignment and micromechanical stops
Author(s)
Hutter, M.
Oppermann, H.
Engelmann, G.
Reichl, H.
Hauptwerk
6th Electronics Packaging Technology Conference, EPTC 2004. Proceedings
Konferenz
Electronics Packaging Technology Conference (EPTC) 2004
DOI
10.1109/EPTC.2004.1396639
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM