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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps

 
: Hutter, M.; Hohnke, F.; Oppermann, H.; Klein, M.; Engelmann, G.

:

IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Industries Alliance -EIA-; Electronic Components, Assemblies, and Materials Association:
54th Electronic Components & Technology Conference 2004. Proceedings. Vol.1 : Las Vegas, Nevada, USA, June 1 - 4, 2004
Piscataway, NJ: IEEE Service Center, 2004
ISBN: 0-7803-8365-6
ISBN: 0-7803-8366-4
pp.49-57
Electronic Components and Technology Conference (ECTC) <54, 2004, Las Vegas/Nev.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-32908.html