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In-situ analysis of an industrial material compound package by means of X-ray micro tomography and digital volume correlation

 
: Haase, S.; Noack, E.; Scheiter, L.; Seiler, B.; Dost, M.; Rzepka, S.

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Fulltext (PDF; )

Kastner, J. ; FH Oberösterreich, Wels; Österreichische Gesellschaft für zerstörungsfreie Prüfung -ÖGZfP-; Deutsche Gesellschaft für Zerstörungsfreie Prüfung e.V. -DGZfP-, Berlin; Schweizerische Gesellschaft für Zerstörungsfreie Prüfung; Deutsche Gesellschaft für Materialkunde -DGM-, Arbeitskreis Tomografie:
Conference on Industrial Computed Tomography, ICT 2014 : Non-destructive testing, 3D materials characterisation and dimensional measurement; 5th conference, 25th-28th February 2014, University of Applied Sciences Upper Austria, Wels Campus; Proceedings
Aachen: Shaker, 2014
ISBN: 978-3-8440-2557-6
pp.363-370
Conference on Industrial Computed Tomography (ICT) <5, 2014, Wels>
Industrielle Computertomografie Tagung <5, 2014, Wels>
English
Conference Paper, Electronic Publication
Fraunhofer ENAS ()

Abstract
The characterization of the thermo-mechanical deformation behavior and failure mechanism plays a central role in reliability evaluations of packaging technology for power electronics. This paper demonstrates the potential of laboratory X-ray micro-computed tomography (X-CT) to characterize the thermo-mechanical behavior of industrial packages through in-situ experiments. A specific thermal loading device offers the possibility to capture deformations and damages of material compounds in a temperature range up to 300°C. Digital volume correlation (DVC) and a novel method based on digital image correlation (DIC) are applied to estimate the deformation field within the specimen at each loaded state as well as the thermal expansion of a specific layer.

: http://publica.fraunhofer.de/documents/N-328291.html