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Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation

 
: Brueckner, J.; Auerswald, E.; Dudek, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Dehe, A.

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Institute of Electrical and Electronics Engineers -IEEE-; Circuits Multi-Projets -CMP-, Grenoble:
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014 : Cannes, France, 1 - 4 April 2014
Piscataway, NJ: IEEE, 2014
ISBN: 978-2-35500-028-7
ISBN: 978-1-4799-3221-4
pp.332-337
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <2014, Cannes>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
The strength of poly-silicon membranes was investigated by experimental tests and numerical simulations. A new fracture test has been developed that replicates the loading situation under real service conditions well but with higher stress level. A set of 45 membranes was tested at each of the three positions on the wafer in order to assure statistical accuracy and to evaluate the strength distribution across the wafer. Using finite element simulation, fracture stresses were calculated and analyzed by means of a two-parametric Weibull distribution subsequently. High values were found for the characteristic fracture stresses. They are in the range of 5,400-6,000 MPa.

: http://publica.fraunhofer.de/documents/N-328286.html