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Thermocompression bonding of semiconductor wafers
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2014
Book Article
Titel
Thermocompression bonding of semiconductor wafers
Author(s)
Frömel, J.
Baum, Mario
Wiemer, Maik
Hauptwerk
Smart systems integration for micro- and nanotechnologies
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS