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Ceramic wafer bonding for vertically integrated MEMS

 
: Wuensch, D.; Froemel, J.; Wiemer, M.; Gessner, T.

Surface Mount Technology Association -SMTA-:
11th International Wafer-Level Packaging Conference, IWLPC 2014. CD-ROM : San Jose, California, November 11th - 13th, 2014
San Jose/Calif., 2014
pp.316-322
International Wafer-Level Packaging Conference (IWLPC) <11, 2014, San Jose/Calif.>
English
Conference Paper
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/documents/N-323975.html