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Improving the FE simulation of molded packages using warpage measurements

: Huber, Saskia; Dijk, Marius van; Walter, Hans; Wittler, Olaf; Thomas, Tina; Lang, Klaus-Dieter


Microelectronics reliability 54 (2014), No.9-10, pp.1862–1866
ISSN: 0026-2714
European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF) <25, 2014, Berlin>
Conference Paper, Journal Article
Fraunhofer IZM ()

Due to the constant development of new components in microsystem technology the possibility to guarantee the reliability and lifetime of these components is essential. An efficient method for this purpose is Finite Element (FE) modelling. In order to shorten lengthy and expensive lifetime tests, FE simulations become more and more necessary. To obtain suitable FE models, multitude of material and technical component characteristics are needed. However, due to the rapid development of new materials, the characteristics are often insufficient or even unknown. Therefore additional measurements of the material or the complete system are necessary. Which material data is required depends first and foremost on the component and its usage. In this paper the importance of temperature dependent topographic measurements for the simulation model of a package design (Smart Power Module) will be demonstrated. The warpage of a whole package was measured at different temperatures in order to obtain unknown material behaviour like the chemical shrinkage and polymer relaxation. For this purpose, the Shadow Moiré Measurement Method was utilised. This work will focus on how to obtain experimental data of two different molding compounds (MC) in several stages of lifetime as well as implementing the results in a FE simulation model.