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Solid Liquid Inter-Diffusion Bonding at Low Temperature

 
: Frömel, J.; Baum, M.; Wiemer, M.; Gessner, T.

:

Suga, T. ; Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. Proceedings : 15-16 July 2014, Tokyo, Japan
Piscataway, NJ: IEEE, 2014
ISBN: 978-1-4799-5260-1
ISBN: 978-1-4799-5261-8
ISBN: 978-1-4799-5262-5
pp.62
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) <4, 2014, Tokyo>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
Solid Liquid Inter-Diffusion (SLID) bonding using the systems Cu/Ga and Au/In have been investigated regarding the bonding parameters and their influence on shear strength. Especially temperature dependence and composition of interface have been focused on.

: http://publica.fraunhofer.de/documents/N-318210.html