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Thermographic Testing Methods with High Temporal and Spatial Resolution

: Netzelmann, U.; Walle, G.; Karpen, W.; Meyendorf, N.

Michel, B.; Winkler, T.; Werner, M.; Fecht, H.-J. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; Deutscher Verband für Materialforschung und -prüfung e.V. -DVM-, Berlin:
MicroMat 2000. Proceedings 3rd International Conference and Exhibition Micro Materials : April 17 - 19, 2000, Berlin, Germany
Dresden: ddp Goldenbogen, 2000
ISBN: 3-932434-15-3
Micro Materials (Micro Mat) <3, 2000, Berlin>
Conference Paper
Fraunhofer IZFP ()
nondestructive testing; thermal wave; thermography; wafer

Microstructures in semiconductors and in ferrite were imaged by pulsed thermography and by thermal wave microscopy. The lateral resolution ranges down to 50 µm for thermoagraphy and 5 µm respectively. The advantage of both techniques is their contact-free operation with ability to obtain sub-surface information.