Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Thermographic Testing Methods with High Temporal and Spatial Resolution
| Michel, B.; Winkler, T.; Werner, M.; Fecht, H.-J. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; Deutscher Verband für Materialforschung und -prüfung e.V. -DVM-, Berlin:
MicroMat 2000. Proceedings 3rd International Conference and Exhibition Micro Materials : April 17 - 19, 2000, Berlin, Germany
Dresden: ddp Goldenbogen, 2000
ISBN: 3-932434-15-3
pp.1079-1081 |
| Micro Materials (Micro Mat) <3, 2000, Berlin> |
|
| English |
| Conference Paper |
| Fraunhofer IZFP () |
| nondestructive testing; thermal wave; thermography; wafer |
Abstract
Microstructures in semiconductors and in ferrite were imaged by pulsed thermography and by thermal wave microscopy. The lateral resolution ranges down to 50 µm for thermoagraphy and 5 µm respectively. The advantage of both techniques is their contact-free operation with ability to obtain sub-surface information.