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Robust module integration of back contact cells by interconnection adapters

: Ebert, M.; Seckel, M.; Böttcher, L.; Hendrichs, M.; Clement, F.; Dürr, I.; Biro, D.; Eitner, U.; Schneider-Ramelow, M.

Fulltext urn:nbn:de:0011-n-3112727 (268 KByte PDF)
MD5 Fingerprint: f0e57f0ad3eb92795c0850afa38fd05f
Created on: 7.11.2014

Bokhoven, T.P. ; European Commission:
29th European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC 2014 : Proceedings of the international conference held in Amsterdam, The Netherlands, 22 - 26 September 2014, DVD
München: WIP, 2014
ISBN: 3-936338-34-5
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <29, 2014, Amsterdam>
Conference Paper, Electronic Publication
Fraunhofer ISE ()
photovoltaisches Modul; Systeme und Zuverlässigkeit; Silicium-Photovoltaik; Photovoltaische Module und Kraftwerke; Modulentwicklung; reduction; module; contact; integration; substrate

The large-scale production of highly efficient back-contact solar cells and their module integration is a promising route for the reduction of cost per watt peak of photovoltaic modules. Back-contact solar cells contain complex contact structures all located on the rear side posing new challenges for interconnection and encapsulation. The goals of our work are the development and demonstration of an interconnection adapter in cell size with an integrated circuitry to stabilize the fragile back contact solar cell and to enable a simple and robust subsequent cell-to-cell interconnection process. We demonstrate a first version of the adapter in form of a TPU (Thermoplastic polyurethane)-copper laminate. An electrically conductive adhesive is applied onto the cell rear side as a lead-free, flexible and gentle solder replacement to connect the cell metallization with the copper circuitry of the adapter. Moreover, interconnection losses and material consumption of the adapter are analyzed by electrical FEM simulations. We show a proof of concept with PV modules having cell-to-module losses in power below 1% proving the feasibility of the concept. Preliminary thermal cycling and damp heat test are passed with power loss of modules after degradation of less than 3.2%