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Laserbasiertes Verfahren und Bearbeitungstisch zur Metallisierung der Rückseite eines Halbleiterbauelements

LASER-BASED METHOD AND MACHINING TABLE FOR METALLISING THE BACK OF A SEMICONDUCTOR COMPONENT
 
: Hauser, Hubert; Nekarda, Jan; Preu, Ralf; Bläsi, Benedikt

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Frontpage ()

DE 102012214253 A1: 20120810
German
Patent, Electronic Publication
Fraunhofer ISE ()

Abstract
The invention relates to a method for metallising the back of a semiconductor component, which semiconductor component is part of a photovoltaic cell or a preliminary stage in the production process of a photovoltaic cell, comprising the following method steps: A - applying at least one at least single-layer metal film on the back of the semiconductor component; B - locally heating at least the metal film, such that the metal film fuses momentarily in local areas. It is essential that a hollow is formed at least in regions between the metal film and back of the semiconductor component, which hollow is filled with a filling medium, which filling medium has an optical refractive index of less than 1.4. The invention also relates to a photovoltaic cell which is produced using such a method and a machining table for carrying out such a method.

: http://publica.fraunhofer.de/documents/N-311131.html