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Herstellungsverfahren

METHOD FOR PRODUCING A COVER FOR OPTICAL MEMS PACKAGING
 
: Langa, Sergiu; Drabe, Christian; Sandner, Thilo

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Frontpage ()

DE 102012217793 A1: 20120928
German
Patent, Electronic Publication
Fraunhofer IPMS ()

Abstract
Embodiments of the invention relate to production methods. In a first step, a semiconductor substrate is provided that has a lattice plane extending non-symmetrically and offset at an angle [alpha] to at least one first main surface region or one second main surface region of the semiconductor substrate, the first main surface region and the second main surface region extending parallel to one another. In a second step, anisotropic etching is carried out into the semiconductor substrate proceeding from the first main surface region, so as to obtain an etch structure that has, in one plane which extends perpendicularly to the first main surface region of the semiconductor substrate, two different etch angles in relation to said first main surface region. In a third step, a covering layer is arranged on the first main surface region of the semiconductor substrate such that the covering layer lies against the etch structure in at least some sections. In a fourth step, some sections of the material of the semiconductor substrate are removed, proceeding from the second main surface region, in the region of the deformed covering layer such that said covering layer is exposed in at least one window region.

: http://publica.fraunhofer.de/documents/N-311039.html