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Passivierte Endoberflaechen

Process to manufacture a microelectronic component in a gas plasma by cleaning and application coating with a passive surface agent.
 
: Hegemann, D.; Oehr, C.; Mueller, M.

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Frontpage ()

DE 2003-10359371 A: 20031218
DE 2003-10359371 A: 20031218
EP 2004-29929 A: 20041217
DE 10359371 A1: 20050728
EP 1544320 A2: 20050622
C23F0017
C23C0016
German
Patent, Electronic Publication
Fraunhofer IGB ()

Abstract
Die Erfindung betrifft ein Verfahren zur Passivierung einer fuer die Verloetung vorgesehenen Endoberflaeche im Plasma sowie eine verbesserte passivierte Endoberflaeche, die durch dieses Verfahren erhaeltlich ist.

 

EP 1544320 A UPAB: 20050823 NOVELTY - In a process to manufacture a microelectronic component, a surface is rendered passive and suitable for a soldering process. In the presence of a gas plasma, the surface is de-oxidised cleaned and covered by a passive coating agent in a single process. The passive coating is removable by a soldering process. Also claimed is a suitable microelectronic component. USE - Process to manufacture a microelectronic component. ADVANTAGE - The process replaces a multi-stage process with a single-stage process.

: http://publica.fraunhofer.de/documents/N-30966.html