Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. MID-Technology: New Applications, Materials, Plating Concepts
| American Electroplaters and Surface Finishers Society -AESF-, Orlando/Fla.:
Finishing Technology into the Millenium. Proceedings AESF SUR/FIN 2000 Annual International Technical Conference
Chicago, Ill., 2000 |
| SUR/FIN <2000, Chicago/Ill.> |
|
| English |
| Conference Paper |
| Fraunhofer IPA () |
| MID; Mechatronik; liquid crystal polymer (LCP) |
Abstract
The MID-technology (Moulded Interconnect Devices) is a relatively new technology for the manufacturing of components with integrated electrical and mechanical functions. The electrical functions are achieved by partial metallisation of the plastic substrate. Two important substrate materials (LCP, Liquid Crystal Polymer, and polyamide) are presented and the different concepts for selective plating by electroless plating technologies (Copper, Nickel) are discussed. The end finish is generally built up by electroplating e.g. copper or tin or by electroless nickel/immersion gold.
New MID-applications for mechatronics are presented.