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Recent results and developments in temporary wafer bonding and –debonding on 300mm leading edge tools

 
: Schima, Mario; Wagenitz, K.; Wendling, R.; Grafe, J.; Wiesbauer, H.; Uhrmann, T.; Wolf, M.J.; Lang, K.-D.

Gessner, T.:
Smart Systems Integration 2014 : Wien/Österreich, 26.3.2014 - 27.3.2014; 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components
Aachen: Apprimus-Verlag, 2014
ISBN: 978-3-86359-201-1
pp.565-567
Smart Systems Integration Conference (SSI) <2014, Vienna>
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <8, 2014, Vienna>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Thin wafer handling is the key enabler for heterogeneous 3D-Wafer-Level-Integration. One example is the uprising Silicon Interposer, which is now widely accepted to be one of the most promising ways for heterogeneous 3D-Wafer-Level-Integration. As well as other TSV based integration schemes, these technologies require working with thinned wafers. Typically, an interposer, is 100μm thick, has TSVs with a diameter of 10μm and topology on both sides. An example for this topology, especially wafer debonding has to deal with, is a high density micro pillar array with tin cap (30μm height) for high I/O chip interconnects.

: http://publica.fraunhofer.de/documents/N-303672.html