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3D technology as a holistic approach - quo vadis?

Presentation held at European 3D TSV Summit, Grenoble, France, 21.01.-22.01.2014
 
: Wolf, M. Jürgen; Schneider, Peter; Schulz, Stefan; Zschech, Ehrenfried

:
presentation urn:nbn:de:0011-n-3036624 (3.9 MByte PDF)
MD5 Fingerprint: f98ff3b06048f9b4e0de75cd79b7ecf7
Created on: 22.8.2014


2014, 37 Folien
European 3D TSV Summit <2014, Grenoble>
English
Presentation, Electronic Publication
Fraunhofer IZM ()
Fraunhofer EAS ()
Fraunhofer ENAS ()
Fraunhofer IKTS ()

Abstract
The presentation gives an overview about the key enabling technologies for 3D system integration, describes in details the holistic approach and the competencies of the Fraunhofer Cluster 3D Integration in the areas design, technology, analytic, simulation and reliablity.

: http://publica.fraunhofer.de/documents/N-303662.html