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Power electronics packages with embedded components - recent trends and developments
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2014
Journal Article
Titel
Power electronics packages with embedded components - recent trends and developments
Author(s)
Boettcher, L.
Karaszkiewicz, S.
Manessis, D.
Ostmann, A.
Zeitschrift
Printed circuit design & fab
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM