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An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions

 
: Poshtan, E.A.; Rzepka, S.; Michel, B.; Silber, C.; Wunderle, B.

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Institute of Electrical and Electronics Engineers -IEEE-:
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 : 7-9 April 2014, Ghent , Belgium
Piscataway, NJ: IEEE, 2014
ISBN: 978-1-4799-4791-1 (Print)
ISBN: 978-1-4799-4790-4
pp.156-162
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <15, 2014, Ghent>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
In this paper, an accelerated and cost-effective characterization method for bi-material interfaces under cyclic loading using a Miniaturized Cyclic Mixed-mode Bending (MCMB) test setup is presented. The Modified Single Leg Bending (MSLB) samples are acquired directly from production-line Thin Quad Flat Package (TQFP) which provide a mixed-mode I + II loading condition. Under sub-critical cyclic loading, crack was found to occur at the polymer-metal interface. The crack length is measured using three methods: (i) in-situ measurements using microscope (ii) gray scale correlation method (iii) numerical method. The crack growth rate was found to have a power-law dependence on the strain Energy Release Rate (ERR) range. In addition influence of plasma cleaning on interfacial adhesion properties namely, crack initiation and propagation is discussed.

: http://publica.fraunhofer.de/documents/N-301406.html